Dry Process

SEMI-AUTOMATIC Target Hole Drilling Machine KX-ZB2530

   

Product Specification:
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Product Details

 

 

Features
 
◆ Use High Precision HINWIN Linear Guide
◆ Spindle Speed 60000rpm /40000rpm
◆ Drilling Offset Accuracy Is ≤0.02mm
◆ Can Drilling Single Side,Double Side /Multi Layer PCB,MCPCB

 

Drilling Hole Dia
1.0-6.0 mm
Board Thickness
0.2-3.0mm
Drilling Precision:
Center deviation ≤0.03mm,Aperture deviation≤0.03mm
Drilling Speed
≤0.6s / Holes
Power:
220V±10% 1.5KVA
Air Pressure:
≥0.6mpa
Machine Size:
900*820*1180mm
Machine Weight:
200KG
Spindle Speed :
40000 RPM
Spindle Power
Spindle Power
Tool change way
Manual tool change

 

 

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